Packaging Engineer

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

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Job Description

Corporate Package Technology Department supports all Business Unit to offer adapted products.

Reporting to Rousset Manager Package Engineering, you will integrate 4 people team. As a Package Development Engineer, you will supervise Packaging solutions for electronic components of MPU32 Business Unit and Aerospace and Defense Group (ADG). You will maintain the specific database for ADG. You will work in collaboration with Die Designers, Product and Test Engineering teams, as well as Asia/worldwide manufacturers.

After an internal training period, this position will offer you a large autonomy to identify the most optimized package solutions and will allow you to develop your knowledge.

Requirements/Qualifications

To reach targets, you engage your responsibility on the following aspects:

• Handle Package development, including all technical aspects: feasibility, study, evaluation and documentation.
• Carry out and analyze thermo-mechanical, electrical and reliability simulations.
• Collaborate with Marketing, Die Designers, Product Engineers, Production Subcontractors, Assembly Engineering,
• Support Failure Analysis related to package issues, for external customers or during Qualifications.
• Perform qualification and industrialization of package solutions.

Travel Time

0% - 25%

To all recruitment agencies

Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.