NPI Packaging

About The Job

We are looking for an experienced NPI Packaging Engineer to lead the technical development of high-performance, high-density semiconductor packaging solutions for Presto products. In this role, you will work across the full development cycle, from package concept and technology selection through design, validation, qualification, and handover to manufacturing. You will collaborate closely with internal teams and external OSAT partners to ensure robust, scalable, and cost-effective packaging solutions.

Your Responsibilities

• Lead the technical development of advanced semiconductor package solutions for Presto products.
• Work closely with Chip Design, Application Engineering, Operations, and external OSAT partners across Europe, the US, and Asia.
• Evaluate packaging technologies and identify the best solutions to support the product roadmap.
• Drive package technology development with suppliers and manufacturing partners.
• Design wirebond, flip‑chip, and embedded semiconductor packages, including back‑end wafer process modifications, to meet form factor, electrical, and thermal targets.
• Improve design processes, tools, and methodologies to support efficient, right‑first‑time development.
• Maintain professional networks to stay current on packaging technologies and process developments across industry and academia.
• Support test teams and customers with package outline drawings, thermal models, application notes, and technical expertise.
• Review and report assembly data collection results for each package type.

Requirements

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or a related discipline.
• Around 6 years of relevant experience in semiconductor packaging or NPI‑related development.
• Proven experience with assembly flows for lead‑frame packages such as DFN and QFN, as well as BGA, SiP, WLCSP, and advanced packages.
• Experience creating designs using supplier design rules and modern 3D CAD tools such as AutoCAD or similar.
• Strong understanding of thermal characterization for semiconductor packages.
• Ability to work effectively in cross‑functional, global teams.
• Strong ownership, prioritization, and delivery mindset.
• Confident in preparing and presenting technical results to internal and external stakeholders.
• English proficiency sufficient to understand, communicate, speak, and write effectively.

Preferred Qualifications

• Experience with 3D multiphysics simulation tools such as Cadence tools, ANSYS tools, or equivalent for thermal, electrical, and stress analysis.
• Experience with package qualification tests such as MSL, TC, HAST, and HTS according to JEDEC and related standards.
• Strong problem‑solving ability using structured methods such as 8D and DOE.
• Experience with package layout design in Cadence Allegro X APD.
• Proficiency with Klayout.

What success looks like

In this role, success means delivering reliable packaging solutions that meet performance, thermal, and manufacturability targets while supporting product readiness for NPI milestones. You will be expected to work independently, coordinate effectively across teams and regions, and contribute to the continuous improvement of package development practices.

What We Can Offer You

Become part of an international company with friendly, smart, and passionate colleagues and join a great workplace that is heavily invested in making everyone feel valued and motivated.