Remote PIC Packaging & Optical Characterization

InSpek in Paris seeks a PIC Packaging and Characterization Engineer to own the physical realization of PIC-based sensing probes—from packaging to chip module characterization. You will collaborate with photonics and applications engineers and share testing duties with the team, reporting to the Head of Photonics.

The role covers PIC packaging, optical component sourcing, and coordinating with subcontractors. Strong documentation habits and English fluency are required; French is a plus.