Process Development Engineer (Back-end)
Our innovative new client is currently searching for aProcess Development Engineer to establish and develop manufacturing processes for advanced superconducting interconnects, from initial concept through to prototype assemblies.
Working closely with specialist external suppliers and multidisciplinary engineering teams, you will develop reliable assembly processes, oversee prototype builds and support the introduction of in-house manufacturing capabilities.
This is a hands-on role requiring strong technical expertise in advanced packaging, process development and supplier management, within a fast-paced technology development environment.
Key responsibilities
- Process development: Define manufacturing processes, workflows, work instructions and acceptance criteria, developing a roadmap towards scalable production
- Prototype manufacturing: Coordinate external suppliers and process trials involving flip-chip bonding, bumping, substrate handling and advanced assembly techniques
- Equipment introduction: Specify, select, procure, commission and operate specialist bonding, inspection and metrology equipment
- Process optimisation: Review prototype results, support testing and failure analysis, resolve manufacturing issues and implement improvements
- Cross-functional collaboration: Work closely with engineering teams to translate system requirements into practical manufacturing solutions
- Knowledge transfer: Build effective supplier relationships and ensure process knowledge and learning are retained internally
An experienced, hands‑on process engineer with a background in advanced semiconductor packaging or microelectronics assembly. You will have experience taking complex assemblies from technical requirements through to working prototypes, coordinating external manufacturing partners and resolving process challenges.
You should be comfortable working in laboratory, cleanroom and supplier environments, with the ability to operate effectively in an evolving technology development programme.
Essential requirements
- PhD or relevant Master's degree, with at least five years' relevant hands‑on industry experience
- Background in semiconductor packaging, microelectronics assembly, MEMS packaging, photonics assembly or a related discipline
- Practical knowledge of one or more of the following:
- Flip-chip bonding
- Solder bumping
- Die attach
- Wafer‑level processing
- Precision alignment
- Experience managing technical development activities with external fabrication, bonding or packaging suppliers
- Experience operating or specifying process equipment, such as flip-chip bonders, optical inspection systems, profilometers or X-ray inspection tools
- Comfortable working hands‑on in laboratory, cleanroom or supplier environments
- Strong communication and stakeholder management skills
- Professional proficiency in English.