Pioneering Quantum 3D Packaging Engineer

C12 seeks a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum-computing hardware in Paris. You will design interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while ensuring signal integrity, thermal performance and reliability.

You will build 2.5D/3D integration architectures, define fabrication flows, run simulations, and collaborate across quantum-device, circuit-design, and