PIC Wafer Process Integration Engineer

SCINTIL Photonics is a fabless company developing and commercializing silicon photonics with integrated lasers for the AI datacenters. Based on SCINTIL Heterogeneous Integrated Photonics (SHIP™) technology, we enable low-latency, high-density and power-efficient ultra-high-speed optical interconnects. SCINTIL is an international company headquartered in France, with offices in Canada and the United States.

About the Role

As a member of the Wafer Foundry and Fabrication team, the PIC Wafer Process Integration Engineer will play a key role in the qualification, optimization, and industrialization of SCINTIL's Photonic Integrated Circuit (PIC) manufacturing platform.

Working directly with external semiconductor foundries and R&D partners, the successful candidate will drive process integration activities across the complete wafer fabrication flow, from incoming materials through III-V integration, photonic device fabrication, wafer-level characterization, reliability qualification, and production ramp-up.

A major focus of the role will be the investigation of process excursions, yield losses, and laser reliability issues through structured Failure Analysis (FA), Design of Experiments (DOE), and statistical data analysis. The engineer will act as the technical interface between foundries, design, reliability, test, and operations teams to ensure robust, scalable, and manufacturable PIC technology.

This position covers both technology development and transition to volume manufacturing over the next three years.

Responsibilities

• Monitor and drive wafer qualification and production lots with external foundries, ensuring robust process integration across the complete PIC manufacturing flow.
• Define and execute qualification, characterization, corner lot, and reliability plans to support technology readiness and production ramp-up.
• Analyze wafer, device, reliability, and yield data to identify process excursions, performance variations, and improvement opportunities using statistical methods and DOE.
• Lead root-cause investigations and Failure Analysis activities on photonic devices and integrated lasers, identifying failure mechanisms and driving corrective actions.
• Correlate fabrication processes, device performance, and laser reliability results to improve yield, manufacturability, and long-term product reliability.
• Collaborate with design, test, operations, purchasing, and foundry partners, contributing to Process FMEA, Control Plans, technical reviews, and qualification reports supporting industrialization and risk reduction.

Minimum Requirements (Must Have):

• Master's degree or PhD in Materials Science, Semiconductor Physics, or a related field
• Minimum 5 years of experience in process integration (PIC, semiconductor, or MEMS)
• Strong problem-solving skills
• Experience in risk analysis methodologies (e.g., FMEA)
• Familiarity with Design of Experiments (DOE)
• Strong team spirit and collaborative mindset

Desirable Qualifications (Nice to Have):

• Experience with silicon photonics, III-V photonics, heterogeneous integration, or compound semiconductors.
• Knowledge of laser degradation mechanisms, accelerated lifetime testing, and reliability qualification.
• Hands-on experience with SEM, FIB, EDX/EDS, TEM, or similar characterization techniques.
• Proficiency in Python, MATLAB, JMP, or equivalent data analysis tools.
• Experience with SPC and semiconductor manufacturing data analysis.
• Knowledge of Wafer-to-Wafer and/or Die-to-Wafer bonding processes.