PIC Packaging & Characterization Specialist

InSpek is seeking a PIC Packaging and Characterization Engineer to own the physical realization of PIC-based sensing probes — from packaging to chip module characterization. You will collaborate with our photonics and applications engineers and share optical testing responsibilities with the team.

You will report to the Head of Photonics. The role covers hands-on packaging, characterization, and coordination with external subcontractors and suppliers, with opportunities to grow into a leadership