PIC Packaging and Characterization Engineer

Responsibilities

• Own the physical realization of PIC‑based sensing probes — from PIC packaging through chip module characterization and supplier coordination.
• Collaborate closely with our photonics and applications engineers and share optical testing responsibilities with the team.
• PIC packaging: fibre‑to‑chip coupling, thermal and glue considerations.
• Optical component sourcing and qualification (fibres, filters, isolators, laser sources).
• Troubleshoot optical system issues: coupling, polarization, alignment, signal noise.
• Own assembly protocols and process documentation; keep records current in internal tracking systems.
• Characterize chips and perform quality checks before and after packaging.
• Develop packaging process alongside packaging partners and in‑house to optimize repeatability and yield.
• Coordinate packaging runs and assembly workflows with external subcontractors.
• Act as the primary technical contact with packaging subcontractors and component suppliers.
• Define technical requirements, review proposals, and manage incoming component validation.
• Manage procurement, timelines, and supplier documentation.
• Build and maintain assembly protocols; ensure documentation is complete and traceable after each run.
• Support cross‑functional debugging by maintaining clear records of what changed between runs.

Requirements

• 2+ years of industrial experience working with PIC‑based products
• Hands‑on experience in PIC packaging
• Comfortable working with PICs, optical fibres, and free‑space optical components
• Practical experience with optical characterization tools (lasers, power‑meters, spectrometers)
• Organized and precise — able to own a workflow end‑to‑end with good documentation habits
• Willing to work across domains and learn new understanding related to our field of application.
• Good communication skills; able to coordinate effectively with internal teams and external suppliers
• Fluency in English; French is a plus
• Nice‑to‑have:
• Experience with surface spotting or chip functionalization workflows
• Familiarity with Raman spectroscopy or laser‑based sensing systems

Core Competencies

Demonstrates expertise in PIC packaging and optical characterization, with a strong focus on process optimization, documentation, and supplier coordination. Capable of troubleshooting optical systems and managing workflows effectively across teams and external partners.

Highest‑signal resume keywords

• PIC Packaging
• Optical Characterization Tools
• Supplier Coordination
• Documentation Management
• Optical System Troubleshooting

Hard Skills

• PIC‑Based Products
• Optical Fibres
• Free‑Space Optical Components
• Assembly Protocols
• Quality Checks
• Process Optimization
• Component Validation
• Workflow Management
• Signal Noise Troubleshooting
• Chip Module Characterization

Soft Skills

• Good Communication Skills
• Organized
• Precise

Industry Keywords

• Optical Testing
• Supplier Documentation
• Cross‑Functional Debugging
• Raman Spectroscopy
• Laser‑Based Sensing Systems

Tools & Technologies

• Lasers
• Power-Meters
• Spectrometers