Packaging Design Engineer – Imaging Tech, Hybrid/Remote

Teledyne e2v Semiconductors SAS, based near Grenoble, FR, is hiring a Package Design Engineer to lead the complete design flow of advanced microelectronic packages. The role involves translating customer needs into technical specs, coordinating with packaging vendors, and overseeing R&D and improvement initiatives.

You will work across locations (Grenoble and Seville) with a focus on high-reliability imaging packages, interfacing with project teams, and ensuring robust design reviews from