Package Design Engineer – Imaging & Microelectronics (Teleworking)

Teledyne e2v Semiconductors SAS, based near Grenoble, is seeking a Package Design Engineer to lead the full design flow of advanced microelectronic packages. The role interacts with packaging vendors, assembly houses and project teams to translate requirements into robust packaging solutions.

The position emphasizes electrical, thermal and mechanical simulations, DRC checks and ongoing technology monitoring to shape next‑generation imaging packages in a dynamic Grenoble/Seville setting.