Package Design Engineer – Imaging & Microelectronics

A leading technology company is seeking a Package Design Engineer for their site near Grenoble, France. The successful candidate will manage the design flow of advanced microelectronic packages, interacting closely with vendors and project teams. Candidates should have a background in microelectronics or a related field, along with experience in packaging design. Strong communication skills in English and French are required. This role offers a collaborative environment focused on innovation and continuous improvement.

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