Nanofabrication Internship H/F

This internship will support the development of a new flip‑chip bonding process using our upcoming tool. Your work will focus on optimizing optical lithography and metal deposition processes used to fabricate indium bumps, followed by testing bonding performance and evaluating chip planarity.

The internship will start in September 2026.

Responsibilities

• Develop and optimize an optical lithography process to pattern indium bump structures
• Participate in metal deposition and lift‑off processes for bump fabrication
• Measure and characterize bump geometry (height, diameter, uniformity)
• Perform flip‑chip bonding tests using the new bonding system
• Evaluate bonding quality and verify chip planarity and alignment
• Document process parameters, experimental results, and fabrication workflows
• Contribute to improving process reliability and reproducibility

Requirements

Master 2 student inMicroelectronics orNanotechnology orApplied physics orMaterials science orMicrofabrication.

Hard skills

• Understanding of microfabrication processes
• Ability to follow experimental procedures and document results
• Interest in hands‑on laboratory or cleanroom work
• Basic cleanroom experience is a plus (lithography, deposition, or etching) is a plus

Soft skills

• Fluent in English, with strong written and verbal communication skills
• Curiosity and strong motivation to learn new fabrication techniques
• Attention to detail and experimental rigor
• Problem‑solving mindset when working on process optimization
• Ability to work independently while collaborating with a technical team
• Interest in quantum device fabrication

Benefits

• 1 day off per month
• Half of transportation cost coverage (as per French law)
• Meal vouchers with Swile, as well as access to a fully equipped and regularly stocked kitchen