Advanced 3D Packaging – Platform Integration Lead

IC-Link by imec is a complete solutions provider that manages the full product lifecycle, serving start-ups, SMEs, and established OEMs as well as universities. Our highly experienced ASIC development team realizes over 600 successful tape‑outs per year across technologies such as CMOS, GaN‑on‑SOI, and Si photonics. We are enriching this offering by adding IMEC’s technologies such as Photonic Integrated Circuits and 3D packaging to our portfolio of solutions.

Backed by imec, one of the world’s leading R&D labs in nanoelectronics, IC‑Link offers tailored services adapted to customer needs – from ASIC design including radiation‑hardened designs to package development, testing and qualification.

What you will do

• Lead the development of IMEC’s 3D Packaging Integration platform in IMEC’s (future) fabs, ensuring that process modules, integration flow and test solutions needed to realise key building blocks such as Silicon Interposer, scaled microbumps, Redistribution layers, Through Silicon Vias, Die to Wafer and Wafer to Wafer, are developed towards manufacturing purpose.
• Follow up on test vehicles and customer fab’s program; create and regularly update PDK and ADK according to industrialisation plans.
• Ensure integration platform compatibility with the broader supply chain, including testing and OSAT partners, to align with manufacturing practices.
• Familiar with wafer‑scale 3D integration and unit steps; discuss technical issues with fab engineering teams (internal and external); present roadmap externally.
• Maintain up‑to‑date technical know‑how and benchmark IMEC’s expertise against the rest of the world.
• Collaborate with IC‑Link sector as part of IMEC’s Silicon Technology office, coordinating with integration, design, tape‑out, test and reliability centers.
• Represent imec in contacts with third parties and semiconductor players worldwide; support technology transfers to 3rd parties.
• Operate from imec’s HQ near Brussels in the heart of Europe.

What we do for you

We invite you to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. Your talent, passion and expertise will help shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment, providing ample possibilities for initiative and responsibility. We support and guide you through concrete actions, not just words, with our corporate university imec.academy to foster your technical and personal growth.

We recognize your contribution and award you a market‑appropriate salary with many fringe benefits.

Who you are

• Seasoned semiconductor technologist/engineer with a master’s or PhD and over 10 years of relevant experience in a semiconductor foundry environment.
• Background in 3D/Advanced packaging wafer integration flow is mandatory; good knowledge of EDA systems is a plus.
• Familiar with OSAT and able to interface with them.
• Capable of adapting to imec’s fast‑evolving environment where different TRLs coexist in the same manufacturing line.
• Excellent communication skills; able to represent imec in customer meetings.
• Enthusiastic team player with project‑management capabilities and high initiative.
• Excellent English communication skills.
• Enjoy working in a dynamic and multicultural environment.